Nonvolatile memory and method for fabricating the same

ABSTRACT

Nonvolatile memory and method for fabricating the same, which can prevent damages to a diffusion region between a selection transistor and a memory cell transistor and reduce a cell size, the nonvolatile memory including a semiconductor substrate having a selection transistor and a cell transistor defined thereon, a line form of a first selection gate line formed on the selection transistor region in one direction and a floating gate formed on the cell transistor region in a fixed pattern, an insulating film and a second gate line formed on the first selection gate line at fixed intervals, and an insulating film and a control gate line over the insulating film including the floating gate in a direction the same with the first gate line, impurity regions formed in one region in the semiconductor substrate on both sides of the control gate line and the first selection gate line, a first planar protection film having first contact holes one each to the first selection gate line and to the impurity region, a contact plug in the first contact hole, a conductive layer pattern in contact with the contact plug, a second planar protection film having a contact hole to the conductive layer pattern over the first selection gate line, and a wiring line formed on the second contact hole and the second planar protection film in one direction.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a nonvolatile memory, and more particularly, to a nonvolatile memory and a method for fabricating the same, which can prevent damages to a diffusion region between a selection transistor and a memory cell transistor and reduce a cell size.

2. Background of the Related Art

Being an MOS(Metal On Insulator) memory which holds information recorded in a cell even after power is cut off, the nonvolatile memory has applications in fields of power-on program storage media(for example, built in a computer bios program, various equipment set-up program and the like), operation program memories for vending machine/ticketing machine, font storage media for computer/printer and etc., game machine and the like. In general, there are MASK ROM, PROM, EPROM, EEPROM and flash EEPROM in the nonvolatile memory, and the EEPROM(Electrically Erasable and Programmable Read Only Memory) will be explained as a related art and the present invention.

A related art nonvolatile memory will be explained with reference to the attached drawings. FIG. 1 illustrates a layout of the related art nonvolatile memory, FIG. 2 illustrates a section across line I—I in FIG. 1, FIG. 3 illustrates a section across line II—II in FIG. 1, and FIG. 4 illustrates a section across line III—III in FIG. 1.

Referring to FIGS. 1˜4, a related art EEPROM cell is provided with a semiconductor substrate 10 having an active region and a field region, which active region has a selection transistor region ‘A’ and a cell transistor region ‘B’ defined therein. And, there are a first and a second gate oxide films 12 a and 12 b form in different thicknesses on the selection transistor region ‘A’ and the cell transistor region ‘B’ in the semiconductor substrate 10 respectively, a selection gate line 13 a formed on a region of the second gate oxide film 12 a in the selection transistor region ‘A’ in one direction, a floating gate pattern 13 b and an insulating film 14 formed on a region of the second gate oxide film 12 b in the cell transistor region ‘B’ in a direction identical to the direction of the selection gate line 13 a at a fixed interval, and a control gate 15 a formed on the insulating film 14 in a direction identical to the direction of the floating gate pattern 13 b. And, there are impurity diffusion regions 17 of a conduction type opposite to the semiconductor substrate 10 formed in the semiconductor substrate 10 on both sides of the selection gate line 13 a and the floating gate pattern 13 b/the control gate line 15 a. The impurity diffusion regions 17 are impurity regions to be used as source and drain regions. And, there is a bit line 20 formed to cross the selection gate line 13 a and the control gate line 15 a. The unexplained reference numerals 18 and 21 are a first and a second interlayer insulating films, 19 is a bit line contact hole, 22 is a selection gate contact region and 23 is a common source contact region.

A related art method for fabricating the aforementioned nonvolatile memory will be explained with reference to the attached drawings. FIGS. 5a˜5 g illustrate sections across line IV—IV in FIG. 1 for showing the steps of a related art method for fabricating a nonvolatile memory.

Referring to FIG. 5a, the related art method for fabricating a nonvolatile memory starts with forming a field insulating film 11 on a field region of a semiconductor substrate 10 having a selection transistor region ‘A’, a cell transistor region ‘B’ and the field region defined thereon. Then, a first and a second gate oxide films 12 a and 12 b with thicknesses different from each other are formed on the selection transistor region ‘A’ and the cell transistor region ‘B”, respectively. The first gate oxide film 12 a on the selection transistor region ‘A’ is thicker than the second gate oxide film 12 b on the cell transistor region ‘B’. The thin second gate oxide film 12 b on the cell transistor region ‘B’ is a tunneling oxide film. As shown in FIG. 5b, a first polysilicon layer is deposited on an entire surface, and the first polysilicon layer on regions of the first and second gate oxide films 12 a and 12 b in the selection transistor region ‘A’ and the cell transistor region ‘B’ are subjected to selective patterning (photolithography+etching), to form a selection gate line 13 a on the selection transistor region ‘A’ and a floating gate pattern 13 b on the cell transistor region ‘B’. Then, an insulating film 14 is formed on entire surfaces of the first and second gate oxide films 12 a and 12 b including the selection gate line 13 a and the floating gate pattern 13 b. The insulating film 14 is of an ONO(Oxide Nitride Oxide) structure. Though not shown in the drawings, the floating gate pattern 13 b, patterned in a horizontal direction, is separated in a rectangular form. As shown in FIG. 5c, a second polysilicon layer 15 is formed on an entire surface of the insulating film 14. As shown in FIG. 5d, a first photoresist film PR1 is coated on the second polysilicon layer 15 and subjected to selective patterning by exposure and development, to remove the first photoresist film PR1 from upper portions of the selection transistor region ‘A’ and the cell transistor region ‘B’ adjacent to tie selection transistor region ‘A’. The patterned first photoresist film PR1 is used as a mask to remove the second polysilicon layer 15 selectively, only to leave the second polysilicon layer 15 on the insulating film 14 on the cell transistor region ‘B’. If the second polysilicon layer 15 is left only on a region on which the control gate line is to be formed for forming the control gate line, because the selection gate line 13 a is also etched as the floating gate pattern 13 b under the control gate line is etched, only the second polysilicon layer 15 on the selection transistor region ‘A’ is removed at first. Then, as shown in FIG. 5e, the first photoresist film PR1 is removed, and a second photoresist film PR2 is coated on the second polysilicon layer 15 including the insulating film 14, and subjected to patterning by exposure and development, to leave one portion of the second photoresist film PR2 on an entire surface of the selection transistor region ‘A’ and the other portion on the second polysilicon layer 15 over the floating gate pattern 13 b on the cell transistor region ‘B’ spaced from the one portion. The patterned second photoresist film PR2 is used as a mask in selectively etching and removing the second polysilicon layer 15 and the floating gate pattern 13 b, to form a control gate line 15 a. Upon etching the second polysilicon layer 15 and the floating gate pattern 13 b of the first polysilicon layer, the semiconductor substrate 10 not masked by the second photoresist film PR2 at an interface of the selection transistor region ‘A’ and the cell transistor region ‘B’ is also etched, to form a trench 16, because of etch selectivities and etch rates. In general, though an oxide film, a nitride film and a polysilicon layer differ in the etch selectivities, an etching time period should be paid attention because an oxide film and a nitride film are etched to some extents in a condition a polysilicon layer is etched. And, under the same etch condition, an etch rate of the nitride film is higher than the polysilicon layer, and an etch rate of the oxide film is higher than the nitride film. Because of these reasons, when the second polysilicon layer 15 and the floating gate pattern 13 b are etched, the ONO structured insulating film 14 and the thin second gate oxide film 12 b are also etched as well as the semiconductor substrate 10, forming the unnecessary trench 16. As shown in FIG. 5f, the second photoresist film PR2 is removed, and the selection gate line 13 a and the control gate line 15 a are used as a mask in conducting an ion injection to form impurity regions 17 in the semiconductor substrate 10 on both sides of the selection gate line 13 a and the control gate line 15 a. Then, a first interlayer insulating film 18 is deposited on an entire surface of the semiconductor substrate 10 including the selection gate line 13 a and the control gate line 15 a, a bit line contact region is defined therein, and the first interlayer insulating film 18, the insulating film 14 and the first gate oxide film 12 a, all of which are in the bit line contact region, are subjected to selective patterning(photolithography+etching), to form a bit line contact hole 19. Then, a bit line 20 is formed on an entire surface of the first interlayer insulating film 18 including the bit line contact hole 19 and subjected to patterning to a fixed width. As shown in FIG. 5g, a second interlayer insulating film 21 is deposited on the first interlayer insulating film 18 including the bit line 20. In addition to this, a signal application region to the selection gate line 13 a is defined at one side of the bit line 20(see FIG. 1), and the first and second interlayer insulating films 18 and 21 over the selection gate line 13 a are selectively removed to form a selection gate contact hole 22. And, a common source contact region 23 is formed in an N₊ diffusion region in the cell transistor legion ‘B’.

However, the related art nonvolatile memory and method for fabricating the same have the following problems.

The formation of unnecessary trench in the semiconductor substrate between the selection transistor region and the cell transistor region leads to form irregular impurity regions, that drops a device reliability.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a nonvolatile memory and a method for fabricating the same that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.

An object of the present invention is to provide a nonvolatile memory and a method for fabricating the same, which can prevent damages to impurity regions between a selection transistor and a cell transistor and reduce a resistance of the selection transistor.

Another object of the present invention is to provide a nonvolatile memory and a method for fabricating the same, which can reduce a space between the selection transistor and the cell transistor, to reduce a cell size.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, the nonvolatile memory includes a semiconductor substrate having a selection transistor and a cell transistor defined thereon, a line form of a first selection gate line formed on the selection transistor region in one direction and a floating gate formed on the cell transistor region in a fixed pattern, an insulating film and a second gate line formed on the first selection gate line at fixed intervals, and an insulating film and a control gate line over the insulating film including the floating gate in a direction the same with the first gate line, impurity regions formed in one region in the semiconductor substrate on both sides of the control gate line and the first selection gate line, a first planar protection film having first contact holes one each to the first selection gate line and to the impurity region, a contact plug in the first contact hole, a conductive layer pattern in contact with the contact plug, a second planar protection film having a contact hole to the conductive layer pattern over the first selection gate line, and a wiring line formed on the second contact hole and the second planar protection film in one direction.

In another aspect of the present invention, there is provided a method for fabricating a nonvolatile memory, comprising the steps of (1) forming a gate insulating film on a semiconductor substrate having a selection transistor region and a cell transistor region defined thereon, (2) patterning the first semiconductor layer in line forms in the selection transistor region and to be spaced from one another at fixed intervals in the cell transistor region, (3) depositing an insulating film and a second semiconductor layer on an entire surface of the semiconductor substrate, (4) subjecting the first and second semiconductor layers and the insulating film to etching, so that a line form of a first selection gate line disposed in one direction and a second selection gate line isolated for a distance disposed on the first selection gate line are formed on the selection transistor region, and so that floating gates patterned into fixed forms and a line form of control gate line disposed on the insulating film including the floating gates are formed in one direction, (5) forming impurity regions in one region in the semiconductor substrate on both sides of the first selection gate line and the control gate line, (6) forming a first planar protection film having first contact holes one each to the first selection gate line and to the impurity region on one side of the gate line, (7) forming a contact plug in each of the first contact holes, (8) forming a conductive layer pattern on the contact plugs and the first planar protection film, (9) forming a second planar protection film having a second contact hole to the contact plug on the first selection gate line, and (10) forming a conductive line in one direction both on the second contact hole and the second planar protection film.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention:

In the drawings:

FIG. 1 illustrates a layout of a related art nonvolatile memory;

FIG. 2 illustrates a section across line I—I in FIG. 1;

FIG. 3 illustrates a section across line II—II in FIG. 1;

FIG. 4 illustrates a section across line III—III in FIG. 1;

FIGS. 5a˜5 g illustrate sections across line IV—IV in FIG. 1 for showing the steps of a related art method for fabricating a nonvolatile memory;

FIG. 6 illustrates a layout of a nonvolatile memory in accordance with a first preferred embodiment of the present invention;

FIG. 7 illustrates a section across line I—I in FIG. 6;

FIG. 8 illustrates a section across line II—II in FIG. 6;

FIGS. 9a˜9 d illustrate sections across line I—I in FIG. 6 for showing the steps of a method for fabricating a nonvolatile memory;

FIGS. 10a˜10 c illustrate sections across line II—II in FIG. 6 for showing the steps of a method for fabricating a nonvolatile memory;

FIG. 11 illustrates a layout of a nonvolatile memory in accordance with a second preferred embodiment of the present invention;

FIG. 12 illustrates a section across line III—III in FIG. 11;

FIG. 13 illustrates a section across line IV—IV in FIG. 11;

FIG. 14 illustrates a section across line V—V in FIG. 11;

FIGS. 15a˜15 c illustrate sections across line III—III in FIG. 11 for showing the steps of a method for fabricating a nonvolatile memory; and,

FIGS. 16a˜16 b illustrate sections across line V—V in FIG. 11 for showing the steps of a method for fabricating a nonvolatile memory.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. FIG. 6 illustrates a layout of a nonvolatile memory in accordance with a first preferred embodiment of the present invention, FIG. 7 illustrates a section across line I—I in FIG. 6, and FIG. 8 illustrates a section across line II—II in FIG. 6.

In the first preferred embodiment nonvolatile memory of the present invention, a selection transistor and a cell transistor are formed such that, identical to the cell transistor, the selection transistor also has a stack of a first polysilicon layer and a second polysilicon layer, with the first polysilicon layer adapted to be applied of a voltage. In order to prevent a resistance increase of the second polysilicon formed over a selection gate line, the second polysilicon layer is spaced therefrom. And, a wiring is formed such that the wiring is in contact with a selection gate line of the first polysilicon layer under the spaced region of the second polysilicon layer.

That is, referring to FIGS. 6˜8, the nonvolatile memory in accordance with a first preferred embodiment of the present invention includes a field oxide film 33 on a field region of an N type semiconductor substrate 31 having an active region and a field region defined thereon. The semiconductor substrate 31 has a P-well 32 to a depth. The semiconductor substrate 31 has a selection transistor region and a cell transistor region defined thereon. The selection transistor region has a selection transistor 35 a in one direction, and there is a first gate oxide film 34 a under the selection gate line 35 a. There is a second polysilicon layer 37 over and spaced from the selection gate line 35 a. And, there is an insulating film 36 beneath the second polysilicon layer 37. The insulating film 36 is of an ONO structure. The cell transistor region has a floating gate 35 b on a region thereof patterned in a rectangular form, and a second gate oxide film 34 b under the floating gate 35 b. The second gate oxide film 34 b is thicker than the first gate oxide film 34 a. And, there is a control gate line 37 a on the insulating film 36 including the floating gate 35 b in the same direction with the selection gate line 35 a. The insulating film 36 beneath the control gate 37 a is of an ONO structure. There are a plurality of source regions 38 a and drain regions 38 b in the active region of the semiconductor substrate 31 on both sides of the control gate line 37 a and the selection gate line 35 a in the same direction with the selection gate line 35 a. And, there are a stack of a first interlayer insulating film 39 and a first planar protection film 40 having a first contact hole 41 to isolated portions of the second polysilicon layer 37, the selection gate line 35 a and the drain region 38 b on the cell transistor region. The first interlayer insulating film 39 is formed to wrap sides of the second polysilicon layer 37 in the first contact hole 41. There are tungsten plugs 42 selectively formed in the first contact holes 41. And, there is a metal pattern 43 of a rectangular form both on the tungsten plug 42 formed in the isolated region of the second polysilicon layer 37 and the adjoining first planar protection film 40. And, there is a metal pattern 43 of a line form in contact with the tungsten plug 42 formed in the drain region 38 b over the stack of the floating gate 35 b and the control gate line 37 a in a direction to cross the control gate line 37 a. The tungsten plug 42 in the drain region 38 b is used as the bit line. And, the source region 38 a of the cell transistor is extended between the cell transistors as well as along one side of the semiconductor substrate 31, and there is a metal contact 43 connected to the cell transistors in common through a common source contact region in the extended source region 38 a. The metal contact 43 connected to the common source contact region has a line form in a direction crossing the control gate 37 a. And, there is a stack of a second interlayer insulating film 44 and the second planar protection film 45 having a second contact hole to the metal pattern 43 over the selection gate line 35 a. And, there is a metal line 46 formed on the second planar protection film 45 in contact with the metal pattern 43 through the second contact hole in a direction the same with the selection gate line 35 a.

A method for fabricating a nonvolatile memory in accordance with a first preferred embodiment of the present invention will be explained with reference to the attached drawings. FIGS. 9a˜9 d illustrate sections across line I—I in FIG. 6 for showing the steps of a method for fabricating a nonvolatile memory, and FIGS. 10a˜10 c illustrate sections across line II—II in FIG. 6 for showing the steps of a method for fabricating a nonvolatile memory.

Referring to FIGS. 9a and 10 a, the method for fabricating a nonvolatile memory in accordance with a first preferred embodiment of the present invention starts with forming a P well 32 to a depth in an N type semiconductor substrate 31 having an active region and a field region defined thereon. Then, a field oxide film 33 is formed on the field region by LOCOS (LOCal Oxidation of Silicon). And, the semiconductor substrate 31 is demarcated into a selection transistor region and a cell transistor region.(not shown in the drawings). Ions are injected into a surface of the P well on which the selection transistor region and the cell transistor region are to be formed for adjusting a threshold voltage. An oxide film is deposited on the selection transistor region and the cell transistor region, and the oxide film on the cell transistor region is removed to a depth, so that a thickness of a first gate oxide film 34 a on the selection transistor region is thicker than the second gate oxide film 34 b on the cell transistor region. An undoped first polysilicon layer 35 is deposited on an entire surface including the first and second gate oxide films 34 a and 34 b. Impurity ions are injected into the undoped first polysilicon layer 35 to dope the first polysilicon layer 35. As shown in FIGS. 9b and 10 a, the first polysilicon layer 35 is patterned such that the selection transistor region and the cell transistor region are connected, wherein the selection transistor region is patterned to be elongated in a horizontal direction and the cell transistor region is patterned to be spaced at fixed intervals to one another for forming a floating gate pattern of rectangular form later. An insulating film 36 of ONO structure is deposited on an entire surface, and a doped second polysilicon layer 37 is deposited on an entire surface of a resultant body. Then, the first and second polysilicon layers 35 and 37 on the selection transistor region and the cell transistor region are subjected to anisotropic etching on the same time, to stack the first and second polysilicon layer 35 and 37. According to this, a selection gate line 35 a of the first polysilicon layer 35 of a line form is formed on the selection transistor region, and a second polysilicon layer 37 is formed on the selection gate line 35 a to be spaced at fixed intervals to one another. And, a floating gate 35 b of rectangular form patterned to be spaced at fixed intervals to one another is formed on the cell transistor region, and a control gate line 37 a is formed on the insulating film 36 including the floating gate 35 b parallel to and in a direction the same with the selection gate line 35 a. Then, impurity ions are injected into surfaces of the P well 32 on both sides of the selection gate line 35 a/control gate line 37 a, to form a source region 38 a and a drain region 38 b such that a plurality of the source regions 38 a and the drain regions 38 b are provided in one direction in an array of cells. And, the source region 38 a is extended between the cell transistors as well as along one side of the semiconductor substrate 31. The source region 38 a and the drain region 38 b may be formed by injecting impurity ions into the P well 32 on both sides of the selection gate line 35 a and the control gate line 37 a after light injection of impurity ions into surfaces of the P well 32 on both sides of the selection gate line 35 a and the control gate 37 a and formation of sidewall spacers(not shown) at both sides of the selection line 35 a and the floating gate 35 b/control gate line 37 a. Then, a first interlayer insulating film 39 and a first planar protection film 40 are deposited in succession on an entire surface of a resultant body. Then, first contact holes 41 are formed to expose a top portion of the selection gate line 35 a at an isolated portion of the second polysilicon 37, the drain region 38 b, and one side of the extended source region 38 a respectively, to form a drain contact region in each of the drain regions 38 b and a common source contact region in the source region 38 a.(see FIG. 6). Next, as shown in FIGS. 9c and 10 b, after a tungsten plug 42 is formed in the first contact hole 41, a first metal layer is deposited on an entire surface including the tungsten plug 42. The metal layer is formed by sputtering aluminum. Then, the first metal layer is selectively etched, to form a metal pattern 43. In view of cell array, each of the metal patterns 43 are formed to have a pattern of rectangular form on both of the tungsten plug 42 formed in the isolated region of the second polysilicon layer 37 and the adjoining first planar protection film 40, on the control gate line 37 a over the floating gate 35 b to be connected to the tungsten plug 42 in the drain region 38 b in a direction to cross the control gate line 37 a, and to be connected to the tungsten plug 42 in the common source contact region in a direction to cross the control gate line 37 a. Then, a second interlayer insulating film 44 is deposited on an entire surface. As shown in FIG. 9d and 10 c, a second planar protection film 45 is deposited on the second interlayer insulating film 44. And, the second interlayer insulating film 44 and the second planar protection film 45 are subjected to anisotropic etching, to form a second contact hole to the metal pattern 43 over the isolated portion of the second polysilicon layer 37. And, a second metal layer is deposited on the second contact hole and the second planar protection film 45. Thereafter, the second metal layer is subjected to anisotropic etching such that the second metal layer is in contact with the metal pattern 43 through the second contact hole and formed in a direction the same with the selection gate line 35 a, to form a metal line 46.

A nonvolatile memory in accordance with a second preferred embodiment of the present invention will be explained with reference to the attached drawings. FIG. 11 illustrates a layout of a nonvolatile memory in accordance with a second preferred embodiment of the present invention, FIG. 12 illustrates a section across line III—III in FIG. 11, FIG. 13 illustrates a section across line IV—IV in FIG. 11, and FIG. 14 illustrates a section across line V—V in FIG. 11.

The nonvolatile memory in accordance with a second preferred embodiment of the present invention includes a selection transistor and a cell transistor, wherein, identical to the cell transistor, the selection transistor has a stack of a first and a second polysilicon layers, of which second polysilicon layer is isolated from other ones in the cell array for preventing an increase of resistance of the second polysilicon on the selection gate line. Addition to this, in order to reduce a resistance of the selection gate line of the first polysilicon layer, another wiring line is not formed, but the tungsten plug is connected to the second polysilicon layer that has a low resistance. In further detail, as shown in FIGS. 11, 12, 13 and 14, the nonvolatile memory in accordance with a second preferred embodiment of the present invention includes a field oxide film 33 in a field region of a semiconductor substrate 31 having an active region and the field region defined thereon. The semiconductor substrate 31 has a P well 32 to a depth. The semiconductor substrate 31 has a selection transistor region and a cell transistor region defined thereon. The selection transistor region has a selection transistor 35 a in one direction, and there is a first gate oxide film 34 a under the selection gate line 35 a. There is a second polysilicon layer 37 over and spaced from the selection gate line 35 a. And, there is an insulating film 36 beneath the second polysilicon layer 37. The insulating film 36 is of an ONO structure. The cell transistor region has a floating gate 35 b on a region thereof patterned in a rectangular form, and a second gate oxide film 34 b under the floating gate 35 b. The second gate oxide film 34 b is thicker than the first gate oxide film 34 a. And, there is a control gate line 37 a on the insulating film 36 including the floating gate 35 b in the same direction with the selection gate line 35 a. The insulating film 36 beneath the control gate 37 a is of an ONO structure. There are a plurality of source regions 38 a and drain regions 38 b in the active region of the semiconductor substrate 31 on both sides of the control gate line 37 a and the selection gate line 35 a in the same direction with the selection gate line 35 a. And, there are a stack of a first interlayer insulating film 39 and a first planar protection film 40 having a first contact hole 41 to isolated portions of the second polysilicon layer 37, the selection gate line 35 a and the drain region 38 b on the cell transistor region. In this instance, sides of the second polysilicon layer 37 are exposed to the first contact hole 41. There are tungsten plugs 42 selectively formed in the first contact holes 41. And, there is a metal pattern 43 in contact with the tungsten plug 42 formed in the drain region 38 b over the stack of the floating gate 35 b and the control gate line 37 a in a direction to cross the control gate line 37 a. The tungsten plug 42 in the drain region 38 b is used as the bit line. And, the source region 38 a of the cell transistor is extended along one side of the semiconductor substrate 31, and there is a metal contact 43 connected to the cell-transistors in common through a common source contact region in the extended source region 38 a. The metal contact 43 connected to the common source contact region has a line form in a direction crossing the control gate 37 a. The selection gate line 35 a of the first polysilicon layer 35 formed by ion injection has a resistance of approx. 1000Ω. And, the second polysilicon layer 37 deposited as doped has a resistance approx. 6Ω or 7Ω. Therefore, as the selection gate line 35 a and the second polysilicon layer 37 is connected through the tungsten plug 42 on the selection gate line 35 a, a resistance of the selection gate line 35 a can be reduced.

A method for fabricating a nonvolatile memory in accordance with a second preferred embodiment of the present invention will be explained with reference to the attached drawings. FIGS. 15a˜15 c illustrate sections across line III—III in FIG. 11 for showing the steps of a method for fabricating a nonvolatile memory, and FIGS. 16a˜16 b illustrate sections across line V—V in FIG. 11 for showing the steps of a method for fabricating a nonvolatile memory.

Referring to FIGS. 15a and 16 a, the method for fabricating a nonvolatile memory in accordance with a second preferred embodiment of the present invention starts with forming a P well 32 to a depth in an N type semiconductor substrate 31 having an active region and a field region defined thereon. Then, a field oxide film 33 is formed on the field region by LOCOS (LOCal Oxidation of Silicon). And, the active region is demarcated into a selection transistor region and a cell transistor region.(not shown in the drawings). Ions are injected into a surface of the P well on which the selection transistor region and the cell transistor region are to be formed for adjusting a threshold voltage. An oxide film is deposited on the selection transistor region and the cell transistor region, and the oxide film on the cell transistor region is removed to a depth, so that a thickness of a first gate oxide film 34 a on the selection transistor region is thicker than the second gate oxide film 34 b on the cell transistor region. An undoped first polysilicon layer 35 is deposited on an entire surface including the first and second gate oxide films 34 a and 34 b. Impurity ions are injected into the undoped first polysilicon layer 35 to dope the first polysilicon layer 35. As shown in FIGS. 15b and 16 a, the first polysilicon layer 35 is patterned such that the selection transistor region and the cell transistor region are connected, wherein the selection transistor region is patterned to be elongated in a horizontal direction and the cell transistor region is patterned to leave a floating gate region to be patterned into a rectangular form, later. An insulating film 36 of ONO structure is deposited on an entire surface, and a doped second polysilicon layer 37 is deposited on an entire surface of a resultant body. Then, the first and second polysilicon layers 35 and 37 on the selection transistor region and the cell transistor region are subjected to anisotropic etching on the same time, to form a stack the first and second polysilicon layer 35 and 37. According to this, a selection gate line 35 a of the first polysilicon layer 35 of a line form is formed on the selection transistor region, and a second polysilicon layer 37 is formed on the selection gate line 35 a to be spaced at fixed intervals to one another. And, a floating gate 35 b patterned to be spaced at fixed intervals to one another is formed on the cell transistor region, and a control gate line 37 a is formed on the insulating film 36 including the floating gate 35 b parallel to and in a direction the same with the selection gate line 35 a. Then, impurity ions are injected into surfaces of the P well 32 on both sides of the selection gate line 35 a/control gate line 37 a, to form a source region 38 a and a drain region 38 b such that a plurality of the source regions 38 a and the drain regions 38 b are provided in one direction in an array of cells. And, the source region 38 a is extended between the cell transistors as well as along one side of the semiconductor substrate 31. The source region 38 a and the drain region 38 b may be formed by injecting impurity ions into the P well 32 on both sides of the selection gate line 35 a and the control gate line 37 a after light injection of impurity ions into surfaces of the P well 32 on both sides of the selection gate line 35 a and the control gate 37 a and formation of sidewall spacers(not shown) at both sides of the selection line 35 a and the floating gate 35 b/control gate line 37 a. Then, a first interlayer insulating film 39 and a first planar protection film 40 are deposited in succession.on an entire surface of a resultant body. Then, a first contact hole 41 is formed to expose a portion of the selection gate line 35 a in an isolated portion of the second polysilicon 37 and sides of the second polysilicon layer 37. And, the first contact hole 41 is formed in the drain region 38 b and in the extended portion of the source region 38 a. In this instance, the first contact holes 41 may be formed such that edges of the isolated portion of the second polysilicon layer 37 are exposed. That is, the first contact hole 41 may be formed such that a diameter of the first contact hole 41 in the first planar protection film 40 is greater than a diameter of the first contact hole 41 in the second polysilicon layer 37. Accordingly, a drain contact region is formed in each of the drain regions 38 b and a common source contact region is formed in the source region 38 a(see FIG. 11). Next, as shown in FIGS. 15c and 16 b, a tungsten plug 42 is selectively formed in each of the first contact holes 41. Then, a first metal layer is deposited on an entire surface including the tungsten plug 42. The metal layer is formed by sputtering aluminum. Then, the first metal layer is anisotropically etched, to form a metal pattern 43. In view of cell array, each of the metal patterns 43 are formed on the control gate line 37 a over the floating gate 35 b to be connected to the tungsten plug 42 in the drain region 38 b in a direction to cross the control gate line 37 a. And, as shown in FIG. 11, the metal pattern 43 is formed to have a line structure in one direction in contact with the common source contact region such that the metal pattern is connected to the source regions 38 a in the cell transistor regions in common.

The nonvolatile memory and the method for fabricating the same as has been explained has the following advantages.

First, the formation of the selection transistor by stacking the first and second polysilicon layers in a way identical to the cell transistor can prevent formation of an unnecessary trench between the selection transistor and the cell transistor, that gives damages to the impurity region therein.

Second, the isolation of the second polysilicon layer in the selection transistor having the first and second polysilicon layers reduces a resistance in the second polysilicon in an upper portion of the selection gate line.

Third, the connection of the selection gate line of the selection transistor to the second polysilicon layer through the tungsten plug can prevent an increase of resistance in the selection gate line.

It will be apparent to those skilled in the art that various modifications and variations can be made in the nonvolatile memory and a method for fabricating the same of the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. 

What is claimed is:
 1. A method for manufacturing a memory comprising: on a substrate having a selection transistor region and a cell transistor region defined thereon, forming stacked first and second selection gate lines on the selection transistor region; forming floating gates on the substrate on the cell transistor region; forming control gate lines over and extending between the floating gates formed on the substrate; forming impurity regions in the substrate adjacent the first selection gate line and the control gate line; forming a first planar protection film over the stacked first and second selection gate lines and the floating gates; forming first contact holes in the first planar protection film and the second selection gate line to expose a portion of the first selection gate line and a portion of an impurity region formed in the substrate; forming conductive plugs in the first contact holes; forming a metal contacts electrically connected to the conductive plugs; forming a second planar protection film over the first planar protection film and the metal contacts; forming second contact holes in the second planar protection film to expose portions of the respective metal contacts; and forming a metal line over the second planar protection film and in the second contact holes so as to electrically contact the exposed portions of the metal contacts.
 2. The method as in claim 1, further comprising forming a first gate oxide film under the first selection gate line and a second gate oxide film under the respective floating gates.
 3. The method as in claim 2, wherein the first gate oxide film is thicker than the second gate oxide film.
 4. The method as in claim 3, wherein forming the first and second gate oxide films comprises forming a gate oxide film over the substrate and etching portions of the gate oxide film to define first and second gate oxide films, the first gate oxide film being thicker than the second gate oxide film.
 5. The method as in claim 1, further comprising forming an insulating film between the first and second selection gate lines.
 6. The method as in claim 5, wherein the insulating layer between the first and second selection gate lines has an ONO structure.
 7. The method as in claim 1, wherein forming the first selection gate line and the floating gates comprises forming a first polysilicon layer over the substrate and selectively etching the first polysilicon layer to define the first selection gate line and the floating gates.
 8. The method as in claim 7, wherein forming the second selection gate line and the control gate lines comprises forming a second polysilicon layer over the substrate including the first selection gate line and the floating gates and selectively etching the second polysilicon layer to define the second selection gate line stacked on the first selection gate line and the control gate lines formed over the and extending between the floating gates.
 9. The method as in claim 7, further comprising implanting impurity ions into the first polysilicon layer to obtain a doped first polysilicon layer.
 10. The method as in claim 8, wherein forming the second selection gate line and the control gate lines comprises forming a doped second polysilicon layer over the substrate including the first selection gate line and the floating gates and selectively etching the doped second polysilicon layer to define the second selection gate line stacked on the first selection gate line and the control gate lines formed over the and extending between the floating gates.
 11. The method as in claim 1, further comprising forming an interlayer insulating film over the second selection gate line and control gate lines.
 12. The method as in claim 11, wherein forming the interlayer insulating film comprises covering sidewalls of the second selection gate line with the interlayer insulating film.
 13. The method as in claim 1, further comprising forming an interlayer insulating film between the first and second planar protection films.
 14. The method as in claim 1, further comprising forming a first interlayer insulating film over the second selection gate line and control gate lines.
 15. The method as in claim 14, further comprising forming a second interlayer insulating film between the first and second planar protection films.
 16. The method as in claim 1, wherein the conductive plugs are formed from tungsten.
 17. A method for manufacturing a memory comprising: on a substrate having a selection transistor region and a cell transistor region defined thereon, forming stacked first and second selection gate lines on the selection transistor region; forming floating gates on the substrate on the cell transistor region; forming control gate lines over and extending between the floating gates formed on the substrate; forming impurity regions in the substrate adjacent the first selection gate line and the control gate line; forming a planar protection film over the stacked first and second selection gate lines and the floating gates; forming contact holes in the first planar protection film and the second selection gate line to expose a portion of the first selection gate line, a portion of the second selection gate line, and a portion of an impurity region formed in the substrate; and forming conductive plugs in the contact holes so as to electrically connect the first and second selection gate lines.
 18. The method as in claim 17, further comprising forming a first gate oxide film under the first selection gate line and a second gate oxide film under the floating gates.
 19. The method as in claim 18, wherein the first gate oxide film is thicker than the second gate oxide film.
 20. The method as in claim 19, wherein forming the first and second gate oxide films comprises forming a gate oxide film over the substrate and etching portions of the gate oxide film to define first and second gate oxide films, the first gate oxide film being thicker than the second gate oxide film.
 21. The method as in claim 17, further comprising forming an insulating layer between the first and second selection gate lines.
 22. The method as in claim 21, wherein the insulating layer has an ONO structure.
 23. The method as in claim 17, wherein forming the first selection gate line and the floating gates comprises forming a first polysilicon layer over the substrate and selectively etching the first polysilicon layer to define the first selection gate line and the floating gates.
 24. The method as in claim 22, wherein forming the second selection gate line and the control gate lines comprises forming a second polysilicon layer over the substrate including the first selection gate line and the floating gates and selectively etching the second polysilicon layer to define the second selection gate line stacked on the first selection gate line and the control gate lines formed over the and extending between the floating gates.
 25. The method as in claim 22, further comprising implanting impurity ions in to the first polysilicon layer to obtain a doped first polysilicon layer.
 26. The method as in claim 24, wherein forming the second selection gate line and the control gate lines comprises forming a doped second polysilicon layer over the substrate including the first selection gate line and the floating gates and selectively etching the doped second polysilicon layer to define the second selection gate line stacked on the first selection gate line and the control gate lines formed over the and extending between the floating gates.
 27. The method as in claim 17, wherein the conductive plugs are made from tungsten. 